The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 23, 2021

Filed:

Jan. 15, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Bruce J. Chamberlin, Endicott, NY (US);

Andreas Huber, Boeblingen, DE;

Harald Huels, Boeblingen, DE;

Thomas-Michael Winkel, Boeblingen, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); B23K 11/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); B23K 1/0016 (2013.01); B23K 11/002 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 3/3421 (2013.01); H05K 2203/1115 (2013.01); H05K 2203/163 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/53174 (2015.01);
Abstract

A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.


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