The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Dec. 06, 2011
Harry Barowski, Boeblingen, DE;
Thomas Brunschwiler, Rueschlikon, CH;
Roger F. Dangel, Rueschlikon, CH;
Hubert Harrer, Boeblingen, DE;
Andreas Huber, Boeblingen, DE;
Norbert M. Meier, Rueschlikon, CH;
Bruno Michel, Rueschlikon, CH;
Tim Niggemeier, Boeblingen, DE;
Stephan Paredes, Rueschlikon, CH;
Jochen Supper, Boeblingen, DE;
Jonas R. Weiss, Rueschlikon, CH;
Harry Barowski, Boeblingen, DE;
Thomas Brunschwiler, Rueschlikon, CH;
Roger F. Dangel, Rueschlikon, CH;
Hubert Harrer, Boeblingen, DE;
Andreas Huber, Boeblingen, DE;
Norbert M. Meier, Rueschlikon, CH;
Bruno Michel, Rueschlikon, CH;
Tim Niggemeier, Boeblingen, DE;
Stephan Paredes, Rueschlikon, CH;
Jochen Supper, Boeblingen, DE;
Jonas R. Weiss, Rueschlikon, CH;
International Business Machines Corporation, Armonk, NY (US);
Abstract
An integrated circuit coupling device includes an integrated circuit package with N integrated circuit layers (L-L) arranged as a 3D stack; and a data transmission medium with n data transmission layers (l-l), wherein n≧1 and N≧2, and wherein the N integrated circuit layers are electrically connectable to the n data transmission layers.