Anand Govind

Title: The Innovative Contributions of Anand Govind

Introduction

Anand Govind is a prominent inventor based in Fremont, CA, known for his significant contributions to semiconductor technology. With a total of 12 patents to his name, he has made remarkable advancements in the field, particularly in the design and reliability of semiconductor packages.

Latest Patents

Among his latest patents is the "Robust high density substrate design for thermal cycling reliability." This invention focuses on improving the thermal cycling reliability of semiconductor packages. The design features a first layer with ball pads dispersed throughout and a second layer that provides signal traces. A high-stress area is defined near the corners of the dies, with signal traces routed away from this area to prevent cracks in the routed traces. Another notable patent is the "Routing scheme for differential pairs in flip chip substrates." This patent describes a flip chip substrate that includes multiple conductive layers. It details the arrangement of contacts for differential signal pairs and the routing of traces to minimize length differences, enhancing performance.

Career Highlights

Anand Govind has built a successful career at LSI Logic Corporation, where he has been instrumental in developing innovative semiconductor solutions. His work has not only advanced the technology but has also contributed to the company's reputation as a leader in the industry.

Collaborations

Throughout his career, Anand has collaborated with talented individuals such as Aritharan Thurairajaratnam and Farshad Ghahghahi. These collaborations have fostered a creative environment that has led to the development of cutting-edge technologies.

Conclusion

Anand Govind's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and pave the way for future advancements.