The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Oct. 08, 2003
Anand Govind, Fremont, CA (US);
Zafer Kutlu, Menlo Park, CA (US);
Farshad Ghahghahi, Los Gatos, CA (US);
Anand Govind, Fremont, CA (US);
Zafer Kutlu, Menlo Park, CA (US);
Farshad Ghahghahi, Los Gatos, CA (US);
LSI Logic Corporation, Milpitas, CA (US);
Abstract
A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal traces. A high stress area associated with the corner of the dies is defined. Preferably the high stress area is defined as two ball pitches away from the corner of the die. Signal traces are routed away from the high stress area and in particular signal traces are routed away from the ball pads associated with the high stress to eliminate the cracks in the routed traces.