Ameet S Bhansali

Title: Ameet S Bhansali: Innovator in Integrated Circuit Technology

Introduction

Ameet S Bhansali is a prominent inventor based in Fremont, CA. He has made significant contributions to the field of integrated circuit technology, holding a total of 8 patents. His work focuses on enhancing the efficiency and reliability of electronic components.

Latest Patents

Among his latest patents is a wire bonding surface and bonding method. This invention describes a bonding pad structure designed for use with compliant dielectric materials. A rigid layer is formed between the bonding pad and the compliant dielectric layer, increasing the stiffness of the bonding structure. This innovation allows for effective bonding through conventional ultrasonic and thermosonic methods. Another notable patent involves a C4 substrate contact pad featuring a layer of nickel-boron (Ni-B) plating. This flip chip integrated circuit package includes a layer of nickel-phosphorus (Ni-P) on the pins of the substrate, with gold plated onto the nickel layers. The integrated circuit, equipped with solder bumps, is placed onto the contact pads, and the package is heated to reflow the solder bumps, gold, and nickel-boron into solder joints that secure the integrated circuit to the substrate.

Career Highlights

Ameet S Bhansali is currently employed at Intel Corporation, where he continues to innovate and develop cutting-edge technologies. His work has significantly impacted the efficiency and performance of integrated circuits.

Collaborations

He has collaborated with notable coworkers, including Gay M Samuelson and Venkatesan Murali, contributing to various projects and advancements in the field.

Conclusion

Ameet S Bhansali's contributions to integrated circuit technology through his patents and work at Intel Corporation highlight his role as a key innovator in the industry. His inventions continue to shape the future of electronic components.