The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 1996
Filed:
Mar. 31, 1993
Applicant:
Inventors:
Ameet S Bhansali, Fremont, CA (US);
Gay M Samuelson, Tempe, AZ (US);
Venkatesan Murali, San Jose, CA (US);
Michael J Gasparek, Tempe, AZ (US);
Shou H Chen, Mesa, AZ (US);
Nicholas P Mencinger, Tempe, AZ (US);
Ching C Lee, Penang, MY;
Kevin Jeng, Cupertino, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257643 ; 257673 ; 257741 ; 257753 ; 257780 ; 257781 ;
Abstract
A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.