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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6265300 B1

PDFFull Text
Date of Patent:
Jul. 24, 2001

Filed:

Nov. 18, 1993

Wire bonding surface and bonding method

Applicant:
Inventors:

Ameet S. Bhansali, Fremont, CA (US);

Gay M. Samuelson, Tempe, AZ (US);

Venkatesan Murali, San Jose, CA (US);

Michael J. Gasparek, Tempe, AZ (US);

Shou H. Chen, Mesa, AZ (US);

Nicholas P. Mencinger, Tempe, AZ (US);

Ching C. Lee, Penang, MY;

Kevin Jeng, Cupertino, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Blakely, Sokoloff, Taylor & Zafman LLP

Primary Examiner:

Kevin M Picardat

Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract

A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.

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Bhansali, Ameet. (2001). Wire bonding surface and bonding method (U.S. Patent No. 6265300). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6265300

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