The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 1998

Filed:

Oct. 24, 1997
Applicant:
Inventors:

Ameet S Bhansali, Fremont, CA (US);

Rama K Shukla, Fremont, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
22818022 ; 228219 ; 2282481 ;
Abstract

A low cost method for mechanically and electrically coupling a surface mounted capacitor to a semiconductor package. In one embodiment a metal coating is deposited over the electrodes of a capacitor. Concurrently, or at some other time, solder paste is applied to the electrical contact pads of a semiconductor package. The connection between the capacitor and package is made by positioning the metal coated regions of the capacitor over the electrical contact pads of the package and running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the capacitor and onto the electrical contact pads of the package.


Find Patent Forward Citations

Loading…