Singapore, Singapore

Aksel Kitowski

This inventor holds 5 USPTO granted patents and 1 published patent application. Top assignee: Applied Materials, Inc.. Active years: 2015-2020.

USPTO Granted Patents = 5 

% Patents Active = 80.0

Average Co-Inventor Count = 4.9

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2015-2020

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5 patents (USPTO):Explore Patents

Title: Aksel Kitowski: Innovator in Semiconductor Fabrication

Introduction

Aksel Kitowski is a prominent inventor based in Singapore, known for his contributions to the field of semiconductor thin film fabrications. With a total of 5 patents to his name, he has made significant advancements in the technology that underpins modern electronics.

Latest Patents

His latest patents focus on variable frequency microwave (VFM) processes and applications in semiconductor thin film fabrications. These patents describe methods and apparatus for processing a substrate, including a vacuum multi-chamber deposition tool that features a degas chamber equipped with both a heating mechanism and a variable frequency microwave source. The innovative methods utilize variable frequency microwave radiation to enhance the quality and speed of the degas process without causing damage to the various components involved.

Career Highlights

Aksel Kitowski is currently employed at Applied Materials, Inc., a leading company in the semiconductor industry. His work has been instrumental in pushing the boundaries of semiconductor fabrication technology, making processes more efficient and effective.

Collaborations

Throughout his career, Aksel has collaborated with notable colleagues, including Yueh Sheng Ow and Glen T Mori. These partnerships have fostered an environment of innovation and have contributed to the success of his projects.

Conclusion

Aksel Kitowski's work in variable frequency microwave processes represents a significant leap forward in semiconductor technology. His contributions continue to influence the industry and pave the way for future innovations.

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