Applied Materials, Inc.

Aksel Kitowski

Ananthkrishna Jupudi

Yueh Sheng Ow

Glen T Mori

Ke Chang

Arkajit Roy Barman

Loke Yuen Wong

Chin Hock Toh

Uday Mahajan

Thean Ming Tan

Methods and apparatus for processing a substrate are described herein. A vacuum multi-chamber deposition tool can include a degas chamber with both a heating mechanism and a variable frequency microwave source. The methods described herein use variable frequency microwave radiation to increased quality and speed of the degas process without damaging the various components.

Variable frequency microwave (VFM) processes and applications in semiconductor thin film fabrications

Patterned photoresist is used to attach a carrier wafer to a silicon device wafer. In one example, a silicon wafer is patterned for contact bumps by applying a photoresist over a surface of the wafer and removing the photoresist in locations at which the contact bumps are to be formed. The contact bumps are formed in the locations at which the photoresist is removed. A temporary carrier is attached to the photoresist over the wafer. The back side of the wafer opposite the contact bumps is processed while handling the wafer using the temporary carrier. The temporary carrier is removed. The photoresist on the front side of the wafer with the contact bumps is removed after removing the temporary carrier.

Patterned photoresist to attach a carrier wafer to a silicon device wafer

Thin substrates and mold compound handling is described using an electrostatic-chucking carrier. In one example, a first part of a plurality of silicon chip packages is formed on a front side of a silicon substrate wafer at a first processing station. An a carrier wafer of an electrostatic chuck is attached over the front side of the silicon wafer. The substrate wafer is moved to a second processing station. A second part of the plurality of silicon chip packages are formed on a back side of the silicon wafer at a second processing station. The electrostatic chuck is then released.

Thin substrate and mold compound handling using an electrostatic-chucking carrier

Growing community of inventors

Singapore, Singapore

Aksel Kitowski