Company Filing History:

23 out of 1,009

Amkor Technology, Inc.

patents

3 out of 287

Amkor Technology Singapore Holding Pte. Ltd.

patents

Years Active: 2004-2024

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26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12035472 - Stackable via package and method (2024-07-09),

2. 11700692 - Stackable via package and method (2023-07-11),

3. 11089685 - Stackable via package and method (2021-08-10),

4. 10548221 - Stackable via package and method (2020-01-28),

5. 10257942 - Stackable variable height via package and method (2019-04-09),

6. 10206285 - Stackable via package and method (2019-02-12),

7. 10034372 - Stackable via package and method (2018-07-24),

8. 9730327 - Stackable via package and method (2017-08-08),

9. 9012789 - Stackable via package and method (2015-04-21),

10. 8704368 - Stackable via package and method (2014-04-22),

11. 8623753 - Stackable protruding via package and method (2014-01-07),

12. 8471154 - Stackable variable height via package and method (2013-06-25),

13. 8466545 - Stackable semiconductor package (2013-06-18),

14. 8300423 - Stackable treated via package and method (2012-10-30),

15. 8227905 - Stackable semiconductor package (2012-07-24),

Title: Akito Yoshida: Innovator in Stackable Via Packaging

Introduction:

In the world of innovations and patents, one name stands out as a pioneer in stackable via packaging solutions - Akito Yoshida. Hailing from Chandler, AZ in the United States, Yoshida has made significant contributions to the field with his inventive ideas and expertise. With an impressive portfolio of 25 patents, Yoshida has proven himself as a remarkable innovator in the industry.

Latest Patents:

Among Yoshida's notable achievements are his latest patents on stackable via packages and methods. These inventions revolutionize the way components are integrated within electronic devices. Yoshida's stackable via package includes a substrate with an upper surface and a trace, featuring a terminal. The package also incorporates a solder ball and a via aperture in the package body, effectively preventing solder deformation and bridging between adjacent solder columns.

Career Highlights:

Throughout his career, Akito Yoshida has showcased his visionary talent at renowned companies in the industry. He has successfully initiated and implemented innovative ideas, making a significant impact on the field of stackable via packaging. Yoshida's employment history includes notable stints at companies such as Amkor Technology, Inc. and Amkor Technology Singapore Holding Pte. Ltd.

Collaborations:

Yoshida has had the privilege of working alongside accomplished professionals who have complemented his expertise. Notable among his colleagues are Mahmoud Dreiza and Curtis Michael Zwenger. Such collaborations have amplified the impact of Yoshida's innovations, leading to cutting-edge advancements in the field of stackable via packaging.

Conclusion:

In the realm of innovations and patents, Akito Yoshida's contributions to stackable via packaging have been nothing short of exceptional. With 25 patents to his name, Yoshida's inventive ideas have revolutionized the field, showcasing his remarkable problem-solving skills and dedication to advancement. His collaborations with industry experts have further elevated his impact, bringing his ground-breaking ideas to fruition. Akito Yoshida's work is a testament to the power of innovation, constantly pushing boundaries and shaping the future of electronics packaging.

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.