The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
May. 25, 2010
Robert Francis Darveaux, Gilbert, AZ (US);
Ludovico Bancod, Chandler, AZ (US);
Akito Yoshida, Chandler, AZ (US);
Robert Francis Darveaux, Gilbert, AZ (US);
Ludovico Bancod, Chandler, AZ (US);
Akito Yoshida, Chandler, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A method of forming a stackable treated via package includes coupling interconnection balls to terminals. The interconnection balls are encapsulated in a package body. Via apertures are formed in the package body to expose the interconnection balls. The interconnection balls are treated to form treated interconnection balls comprising treated surfaces. The treated interconnection balls of the stackable treated via package enhance bonding with interconnection balls of a stacked electronic component package thus maximizing yield.