The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2014
Filed:
May. 28, 2009
Akito Yoshida, Chandler, AZ (US);
Mahmoud Dreiza, Phoenix, AZ (US);
Curtis Michael Zwenger, Chandler, AZ (US);
Akito Yoshida, Chandler, AZ (US);
Mahmoud Dreiza, Phoenix, AZ (US);
Curtis Michael Zwenger, Chandler, AZ (US);
Abstract
A method of forming a stackable protruding via package including enclosing an electronic component and electrically conductive first traces on a first surface of a substrate in a package body. Protruding via apertures are formed through the package body to expose the first traces. The protruding via apertures are filled with solder to form electrically conductive vias in direct physical and electrical contact with the first traces. Via extension bumps are attached to first surfaces of the vias. The vias and the via extension bumps are reflowed to form protruding vias. The protruding vias extend from the first traces through the package body and protrude above a principal surface of the package body. The protruding vias enable electrical connection of the stackable protruding via package to a larger substrate such as a printed circuit motherboard. Further, the protruding vias in accordance with one embodiment are formed with a minimum pitch.