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For the Inventor, By the Inventor

Tokyo, Japan

Akira Iio

This inventor holds 13 USPTO granted patents and 1 EPO patent. Top assignees: Japan Synthetic Rubber Co., Ltd., Jsr Corporation, Nitto Electric Industrial Co., Ltd.. Active years: 1977-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akira Iio. Retrieved from https://idiyas.com/inventor/akira-iio

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13

% Patents Active = 100.0


Average Co-Inventor Count = 4.5

ph-index = 7

Forward Citations = 247(Granted Patents)


Location History:

  • Yokkaichi, JA (1977)
  • Yokkaichi, JP (1981 - 2002)
  • Tokyo, JP (1987 - 2004)

Company Filing History:

goldMedal7 out of 377 
 
Japan Synthetic Rubber Co., Ltd.
 patents
silverMedal2 out of 1,078 
 
Jsr Corporation
 patents
bronzeMedal1 out of 172 
 
Nitto Electric Industrial Co., Ltd.
 patents
4. 4 out of 834,570 
Other
 patents
where one patent can have more than one assignee

Years Active: 1977-2004

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13 patents (USPTO):Explore Patents
1. 6740590 - AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING (2004-05-25),
2. 6565767 - Polymer particles and polishing material containing them (2003-05-20),
3. 6454819 - Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device (2002-09-24),
4. 6409780 - Water-laden solid matter of vapor-phase processed inorganic oxide particles and slurry for polishing and manufacturing method of semiconductor devices (2002-06-25),
5. 6375545 - Chemical mechanical method of polishing wafer surfaces (2002-04-23),
6. 6068769 - Aqueous dispersion slurry of inorganic particles and production methods (2000-05-30),
7. 5202388 - Process for producing hydrogenation product of ring-opening polymer (1993-04-13),
8. 5164469 - Transparent resin material (1992-11-17),
9. 5053471 - Transparent resin material (1991-10-01),
10. 4699938 - Pressure-sensitive adhesive composition (1987-10-13),
11. 4246427 - Process for producing methacrylic acid (1981-01-20),
12. 4039583 - Process for producing methacrolein (1977-08-02),
13. 4036901 - Process for producing styrene (1977-07-19),

Title: Akira Iio: Pioneering Inventor from Tokyo

Introduction: Akira Iio is a renowned inventor hailing from Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Akira Iio holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Akira Iio has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs in various industries.

Collaborations: Throughout his career, Akira Iio has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing that has been instrumental in his success as an inventor.

Conclusion: Akira Iio's passion for innovation, coupled with his relentless drive to solve complex technological challenges, has solidified his reputation as a pioneering inventor not only in Tokyo but on a global scale.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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