The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2002
Filed:
Jan. 18, 2000
Applicant:
Inventors:
Hiroyuki Yano, Yokohama, JP;
Gaku Minamihaba, Yokohama, JP;
Yukiteru Matsui, Yokohama, JP;
Katsuya Okumura, Yokohama, JP;
Masayuki Motonari, Tokyo, JP;
Masayuki Hattori, Tokyo, JP;
Akira Iio, Tokyo, JP;
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
C09K 3/14 ; C09G 1/02 ; C09G 1/04 ; B24B 1/00 ;
U.S. Cl.
CPC ...
C09K 3/14 ; C09G 1/02 ; C09G 1/04 ; B24B 1/00 ;
Abstract
A process for chemical mechanical polishing of a working film on a wafer, which entails conducting the chemical mechanical polishing with an aqueous dispersion containing water and composite particles, the composite particles containing polymer particles having at least one of a silicon compound portion or section and a metal compound portion or section formed directly or indirectly on the polymer particles.