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For the Inventor, By the Inventor

Research Triangle Park, NC, United States of America

Ziptronix, Inc.


USPTO Granted Patents = 52

% Expired Patents = 23.1


Trademarks = 2

Forward Citations = 4,292

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8 inventors (with patents filed for the assignee):

goldMedal Paul M Enquist (44 out of 88 patents)

silverMedal Qin-Yi Tong (33 out of 43 patents)

bronzeMedal Gaius Gillman Fountain, Jr (26 out of 109 patents)

4.  Anthony Scot Rose (5 out of 6 patents)

5.  Robert J Markunas (2 out of 15 patents)

6.  Carl T Petteway (1 out of 1 patent)

7.  Gaius Fountain (1 out of 1 patent)

8.  Anthony Scott Rose (1 out of 1 patent)


Core Competencies:
3D IC
Device Integration
Low Temperature Bonding
Room Temperature Bonding
Heterogeneous Annealing
Wafer Bonding
Covalent Bonding
Single Mask Via
Epitaxial Wafer Bonding
Hermetic Encapsulation
Die Handling
Intrinsic Process

52 patents:

1. 9716033 - 3D IC method and device (2017-07-25),
2. 9698126 - Heterogeneous annealing method and device (2017-07-04),
3. 9564414 - Three dimensional device integration method and integrated device (2017-02-07),
4. 9431368 - Three dimensional device integration method and integrated device (2016-08-30),
5. 9391143 - Method for low temperature bonding and bonded structure (2016-07-12),
6. 9385024 - Room temperature metal direct bonding (2016-07-05),
7. 9331149 - Method for low temperature bonding and bonded structure (2016-05-03),
8. 9184125 - Heterogeneous annealing method and device (2015-11-10),
9. 9171756 - 3D IC method and device (2015-10-27),
10. 9082627 - Method for low temperature bonding and bonded structure (2015-07-14),
11. 8846450 - Room temperature metal direct bonding (2014-09-30),
12. 8841002 - Method of room temperature covalent bonding (2014-09-23),
13. 8735219 - Heterogeneous annealing method and device (2014-05-27),
14. 8709938 - 3D IC method and device (2014-04-29),
15. 8524533 - Room temperature metal direct bonding (2013-09-03),
Company Overview
Ziptronix, Inc., based in Research Triangle Park, NC, specializes in advanced 3D integrated circuit technology. The company focuses on innovative solutions for device integration, employing techniques such as low and room temperature bonding, heterogeneous annealing, and wafer bonding. Their expertise in covalent bonding and single mask via technology positions them at the forefront of semiconductor advancements, enabling the development of high-performance electronic devices that meet the evolving demands of the industry.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

Ziptronix, Inc. USPTO Patent Assignee Logo
52 Patents

#11 in Research Triangle Park, NC

#164 in North Carolina

#6,764 in US

#13,555 in the World

Research Triangle Park, NC (US)
Research Triangle Park, NC, United States of America

Ziptronix, Inc.

Forward Citations = 4,292

8 inventors:

goldMedal Paul M Enquist (44 out of 88 patents)

silverMedal Qin-Yi Tong (33 out of 43 patents)

bronzeMedal Gaius Gillman Fountain, Jr (26 out of 109 patents)

4.  Anthony Scot Rose (5 out of 6 patents)

5.  Robert J Markunas (2 out of 15 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ziptronix, Inc.. Retrieved from https://idiyas.com/company/ziptronix

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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