For the Inventor, By the Inventor

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Research Triangle Park, NC, United States of America

Ziptronix, Inc.

USPTO Granted Patents = 52

% Expired Patents = 23.1

EPO Patents = 1

Trademarks = 2

Forward Citations = 4,292

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8 inventors (with patents filed for the assignee):

Paul M Enquist (44 out of 88 patents)

Qin-Yi Tong (33 out of 43 patents)

Gaius Gillman Fountain, Jr (26 out of 107 patents)

4. Anthony Scot Rose (5 out of 6 patents)

5. Robert J Markunas (2 out of 15 patents)

6. Carl T Petteway (1 out of 1 patent)

7. Gaius Fountain (1 out of 1 patent)

8. Anthony Scott Rose (1 out of 1 patent)

Core Competencies:

3D IC

Heterogeneous Annealing

Low Temperature Bonding

Room Temperature Metal Direct Bonding

Covalent Bonding

Wafer Scale Die Handling

Single Mask Via

Wafer Bonding Hermetic Encapsulation

Epitaxial-Like Wafer Bonding

Three Dimensional Device Integration

Integrated Device

52 patents: Sort by Forward Citations

1. 9716033 - 3D IC method and device (2017-07-25),

2. 9698126 - Heterogeneous annealing method and device (2017-07-04),

3. 9564414 - Three dimensional device integration method and integrated device (2017-02-07),

4. 9431368 - Three dimensional device integration method and integrated device (2016-08-30),

5. 9391143 - Method for low temperature bonding and bonded structure (2016-07-12),

6. 9385024 - Room temperature metal direct bonding (2016-07-05),

7. 9331149 - Method for low temperature bonding and bonded structure (2016-05-03),

8. 9184125 - Heterogeneous annealing method and device (2015-11-10),

9. 9171756 - 3D IC method and device (2015-10-27),

10. 9082627 - Method for low temperature bonding and bonded structure (2015-07-14),

11. 8846450 - Room temperature metal direct bonding (2014-09-30),

12. 8841002 - Method of room temperature covalent bonding (2014-09-23),

13. 8735219 - Heterogeneous annealing method and device (2014-05-27),

14. 8709938 - 3D IC method and device (2014-04-29),

15. 8524533 - Room temperature metal direct bonding (2013-09-03),

ZIPTRONIX, INC. is a leading technology company that specializes in advanced semiconductor wafer bonding solutions. With a focus on innovation and customer satisfaction, Ziptronix offers cutting-edge products and services for the microelectronics industry. Through their patented technology, Ziptronix enables smaller, faster, and more energy-efficient devices, empowering their clients to stay ahead of the competition. Visit their website for more information and to explore their range of products and solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

Ziptronix, Inc.

52 Patents

#11 in Research Triangle Park, NC

#164 in North Carolina

#6,754 in US

#13,528 in the World

Research Triangle Park, NC, United States of America

Ziptronix, Inc.

Forward Citations = 4,292

8 inventors:

Paul M Enquist (44 out of 88 patents)

Qin-Yi Tong (33 out of 43 patents)

Gaius Gillman Fountain, Jr (26 out of 107 patents)

4. Anthony Scot Rose (5 out of 6 patents)

5. Robert J Markunas (2 out of 15 patents)

Please report any incorrect information to [email protected]

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