The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Sep. 02, 2014
Applicant:

Ziptronix, Inc., Raleigh, NC (US);

Inventors:

Qin-Yi Tong, Durham, NC (US);

Paul M. Enquist, Durham, NC (US);

Anthony Scot Rose, Cary, NC (US);

Assignee:

ZIPTRONIX, INC., Morrisville, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); B23K 20/02 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76251 (2013.01); B23K 20/02 (2013.01); H01L 21/481 (2013.01); H01L 24/09 (2013.01); H01L 24/11 (2013.01); H01L 24/12 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/89 (2013.01); H01L 24/90 (2013.01); H01L 25/50 (2013.01); H01L 24/28 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/80801 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81013 (2013.01); H01L 2224/81014 (2013.01); H01L 2224/8121 (2013.01); H01L 2224/8183 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81143 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81208 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81894 (2013.01); H01L 2224/8319 (2013.01); H01L 2224/8334 (2013.01); H01L 2224/8383 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83095 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83894 (2013.01); H01L 2224/83895 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/9202 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01003 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1532 (2013.01); H01L 2924/351 (2013.01); Y10T 29/49126 (2015.01);
Abstract

A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.


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