Raleigh, NC, United States of America

Carl T Petteway


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: Carl T. Petteway - Innovator in Semiconductor Handling Technologies

Introduction

Carl T. Petteway is a notable inventor based in Raleigh, NC, recognized for his contributions to the field of semiconductor handling. He holds one patent that showcases his innovative spirit and technical expertise, specifically in the area of wafer scale die handling.

Latest Patents

Petteway is the inventor of a patent titled "Wafer Scale Die Handling." This invention comprises a waffle pack device featuring a member with recesses designed to accommodate die from at least one semiconductor wafer. This innovative member is compatible with semiconductor wafer handling and processing equipment, aiming to enhance the efficiency of semiconductor device assembly. The patent highlights methods for removing die from a singular waffle pack device and subsequently placing them in a semiconductor package to assemble all necessary components for an integrated circuit, along with methods involving multiple waffle pack devices for similar purposes.

Career Highlights

Carl T. Petteway is affiliated with Ziptronix, Inc., where he has applied his knowledge and skills to advance semiconductor technologies. His dedication to innovation has played a crucial role in improving processes in the electronics industry, particularly for integrated circuits.

Collaborations

Throughout his career, Petteway has worked closely with esteemed colleagues such as Paul M. Enquist and Gaius Gillman Fountain, Jr. Their collaborative efforts have contributed to the development of revolutionary technologies within the semiconductor domain.

Conclusion

Carl T. Petteway stands out as an inventive mind in the semiconductor industry, with his patent underscoring the importance of innovative solutions for efficient semiconductor handling. His professional journey, marked by collaboration and technical achievement, continues to influence the future of electronic device assembly and processing technologies.

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