The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 12, 2016

Filed:

Dec. 02, 2015
Applicant:

Ziptronix, Inc., Morrisville, NC (US);

Inventors:

Qin-Yi Tong, Durham, NC (US);

Gaius Gillman Fountain, Jr., Youngsville, NC (US);

Paul M. Enquist, Cary, NC (US);

Assignee:

ZIPTRONIX, INC., Morrisville, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 29/16 (2006.01); H01L 21/02 (2006.01); H01L 21/20 (2006.01); H01L 21/311 (2006.01); H01L 21/762 (2006.01); H01L 23/00 (2006.01); H01L 29/06 (2006.01); H01L 21/322 (2006.01); H01L 27/085 (2006.01);
U.S. Cl.
CPC ...
H01L 29/16 (2013.01); H01L 21/0206 (2013.01); H01L 21/2007 (2013.01); H01L 21/31105 (2013.01); H01L 21/31116 (2013.01); H01L 21/322 (2013.01); H01L 21/76251 (2013.01); H01L 24/26 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 27/085 (2013.01); H01L 29/06 (2013.01); H01L 2224/8301 (2013.01); H01L 2224/8303 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/8319 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83099 (2013.01); H01L 2224/83894 (2013.01); H01L 2224/83896 (2013.01); H01L 2224/83948 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0106 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01007 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01084 (2013.01); H01L 2924/01093 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); Y10S 148/012 (2013.01); Y10S 438/974 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1043 (2015.01);
Abstract

A method for bonding at low or room temperature includes steps of surface cleaning and activation by cleaning or etching. The method may also include removing by-products of interface polymerization to prevent a reverse polymerization reaction to allow room temperature chemical bonding of materials such as silicon, silicon nitride and SiO. The surfaces to be bonded are polished to a high degree of smoothness and planarity. VSE may use reactive ion etching or wet etching to slightly etch the surfaces being bonded. The surface roughness and planarity are not degraded and may be enhanced by the VSE process. The etched surfaces may be rinsed in solutions such as ammonium hydroxide or ammonium fluoride to promote the formation of desired bonding species on the surfaces.


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