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Burghausen, Germany

Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

USPTO Granted Patents = 113

Forward Citations = 1,915

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166 inventors (with patents filed for the assignee):

Rudolf Griesshammer (15 out of 16 patents)

Franz Koppl (14 out of 17 patents)

Gerhard Brehm (7 out of 10 patents)

4. Helene Prigge (7 out of 8 patents)

5. Ingolf Lampert (7 out of 7 patents)

6. Heinz-Jorg Rath (7 out of 7 patents)

7. Dietrich Schmidt (7 out of 8 patents)

8. Helmut Hamster (7 out of 7 patents)

9. Anton Schnegg (6 out of 10 patents)

10. Winfried Lang (6 out of 7 patents)

11. Franz Kohl (6 out of 6 patents)

12. Heinz Herzer (6 out of 6 patents)

13. Horst Stock (6 out of 6 patents)

14. Herbert Jacob (5 out of 5 patents)

15. Helmut Zauhar (5 out of 6 patents)

Core Competencies:

Semiconductor Materials

Silicon Single Crystal

Wafer Polishing

Czochralski Process

Epitaxial Coating

Chemomechanical Polishing

Surface Treatment

Crystal Structure Defects

Abrasive Machining

Silicon Wafers

Rotary Grinding Machines

Contamination-Free Processing

113 patents: Sort by Forward Citations

1. 5660335 - Method and device for the comminution of semiconductor material (1997-08-26),

2. 5567199 - Workpiece holder for rotary grinding machines for grinding semiconductor (1996-10-22),

3. 5492079 - Process for producing rods or blocks of semiconductor material and an (1996-02-20),

4. 5487354 - Method for pulling a silicon single crystal (1996-01-30),

5. 5477808 - Process for reducing the oxygen incorporation into a single crystal of (1995-12-26),

6. 5464159 - Method for the contamination-free size reduction of semiconductor (1995-11-07),

7. 5462011 - Method for pulling single crystals (1995-10-31),

8. 5451267 - Process for the wet-chemical treatment of disk-shaped workpieces (1995-09-19),

9. 5437242 - Process and apparatus for controlling the melt level while pulling (1995-08-01),

10. 5400548 - Process for manufacturing semiconductor wafers having deformation ground (1995-03-28),

11. 5355831 - Epitaxially coated semiconductor wafers having low-oxygen zone of (1994-10-18),

12. 5352637 - Process for producing storage-stable silicon wafer surfaces having (1994-10-04),

13. 5351446 - Method and apparatus for the rotary sawing of brittle and hard materials (1994-10-04),

14. 5324488 - Continuous liquid silicon recharging process in czochralski crucible (1994-06-28),

15. 5287774 - Method and device for producing seamless ribbon and wire loops, and (1994-02-22),

Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH is a leading global supplier of electronic materials used in various industries. With over 50 years of experience, the company develops and manufactures cutting-edge materials for semiconductor production, photovoltaics, and electronics. Wacker-Chemitronic's innovative solutions enable high-performance electronics, efficient solar cells, and advanced semiconductor devices. Visit their website for more information and to explore their extensive range of products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

113 Patents

#1 in Burghausen

#558 in Germany

#6,783 in the World

Burghausen, Germany

Wacker-chemitronic Gesellschaft Fur Elektronik-grundstoffe Mbh

Forward Citations = 1,915

166 inventors:

Rudolf Griesshammer (15 out of 16 patents)

Franz Koppl (14 out of 17 patents)

Gerhard Brehm (7 out of 10 patents)

4. Helene Prigge (7 out of 8 patents)

5. Ingolf Lampert (7 out of 7 patents)

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