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For the Inventor, By the Inventor

Taipei, Taiwan

Unicap Electronics Industrial Corporation


USPTO Granted Patents = 2

Forward Citations = 30

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7 inventors (with patents filed for the assignee):

goldMedal Paul Y Wu (2 out of 21 patents)

silverMedal Scott Chen (2 out of 2 patents)

bronzeMedal Ray Chen (1 out of 4 patents)

4.  Jeff Chang (1 out of 1 patent)

5.  Jane Lu (1 out of 1 patent)

6.  Jonny Ma (1 out of 1 patent)

7.  Edward Huang (1 out of 1 patent)


2 patents:

1. 6711812 - Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages (2004-03-30),
2. 6675472 - Process and structure for manufacturing plastic chip carrier (2004-01-13),
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USPTO Data Jan 1 1976 - Sep 29 2026

2 Patents

#1,495 in Taipei

#4,245 in Taiwan

Taipei, TW
Taipei, Taiwan

Unicap Electronics Industrial Corporation

Forward Citations = 30

7 inventors:

goldMedal Paul Y Wu (2 out of 21 patents)

silverMedal Scott Chen (2 out of 2 patents)

bronzeMedal Ray Chen (1 out of 4 patents)

4.  Jeff Chang (1 out of 1 patent)

5.  Jane Lu (1 out of 1 patent)

Please report any incorrect information to [email protected]
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