For the Inventor, By the Inventor

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Unicap Electronics Industrial Corporation

USPTO Granted Patents = 2

Forward Citations = 30

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7 inventors (with patents filed for the assignee):

Paul Y Wu (2 out of 21 patents)

Scott Chen (2 out of 2 patents)

Ray Chen (1 out of 4 patents)

4. Jeff Chang (1 out of 1 patent)

5. Jane Lu (1 out of 1 patent)

6. Jonny Ma (1 out of 1 patent)

7. Edward Huang (1 out of 1 patent)

2 patents: Sort by Forward Citations

1. 6711812 - Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages (2004-03-30),

2. 6675472 - Process and structure for manufacturing plastic chip carrier (2004-01-13),

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USPTO Data Jan 1 1976 - Jan 6 2026

2 Patents

#1,420 in Taipei

#4,113 in Taiwan

Unicap Electronics Industrial Corporation

Forward Citations = 30

7 inventors:

Paul Y Wu (2 out of 21 patents)

Scott Chen (2 out of 2 patents)

Ray Chen (1 out of 4 patents)

4. Jeff Chang (1 out of 1 patent)

5. Jane Lu (1 out of 1 patent)

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