Company Filing History:
Years Active: 2004
Title: Jane Lu - Innovator in Printed Circuit Board Technology
Introduction
Jane Lu is a prominent inventor based in Taipei, Taiwan. She has made significant contributions to the field of printed circuit board technology, particularly in the development of thermally enhanced substrates. Her innovative approach has paved the way for advancements in electronic packaging.
Latest Patents
Jane Lu holds a patent for a "Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages." This method involves creating a thermally enhanced BGA substrate using a metal core, specifically copper, with dielectric layers applied to each side. Conductive through-core build-up vias are incorporated, and rigidifying non-conductive dielectric sheets are laminated to the surfaces. Conductive layers are then applied, allowing for effective via connections through the dielectric layers to the core conductive layer. This innovation enhances the performance and reliability of electronic devices.
Career Highlights
Jane Lu is currently employed at Unicap Electronics Industrial Corporation, where she continues to push the boundaries of technology in her field. Her work has been instrumental in improving the efficiency and thermal management of electronic components.
Collaborations
Some of her notable coworkers include Paul Y Wu and Ray Chen, who have collaborated with her on various projects within the company.
Conclusion
Jane Lu's contributions to printed circuit board technology exemplify her innovative spirit and dedication to advancing electronic packaging solutions. Her patent and work at Unicap Electronics Industrial Corporation highlight her role as a key player in the industry.