The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Apr. 06, 2000
Applicant:
Inventors:
Jane Lu, Taipei, TW;
Paul Wu, Saratoga, CA (US);
Ray Chen, Fremont, CA (US);
Scott Chen, Tao-Yuan, TW;
Jeff Chang, Taoyuan, TW;
Assignee:
Unicap Electronics Industrial Corporation, Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 ;
U.S. Cl.
CPC ...
H01K 3/10 ;
Abstract
A method of making a thermally enhanced BGA substrate in which a metal (copper) core, has dielectric layers applied to each side thereof and conductive through-core build-up vias are provided. Rigidifying non-conductive dielectric sheets are laminated to the oppositely facing surfaces and then conductive layers are applied to at least one of the rigidifying non-conductive sheets and via connections are made through the dielectric layer(s) to the core conductive layer.