This inventor holds 1 USPTO granted patent. Top assignee: Unicap Electronics Industrial Corporation. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Jeff Chang - Innovator in Thermal Enhancement for BGA Packages
Introduction
Jeff Chang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of printed circuit board technology, particularly in the area of thermally enhanced ball grid array (BGA) packages. His innovative approach has led to the development of a unique method that improves the performance and reliability of electronic components.
Latest Patents
Jeff Chang holds a patent for a "Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages." This patent describes a method that utilizes a metal (copper) core with dielectric layers applied to each side. The design includes conductive through-core build-up vias, which enhance thermal performance. Rigidifying non-conductive dielectric sheets are laminated to the surfaces, and conductive layers are applied to at least one of these sheets, allowing for effective via connections through the dielectric layers to the core conductive layer. This innovation is crucial for improving the thermal management of electronic devices.
Career Highlights
Jeff Chang is currently employed at Unicap Electronics Industrial Corporation, where he continues to develop advanced technologies in the electronics sector. His work focuses on enhancing the efficiency and functionality of electronic components, making significant strides in the industry.
Collaborations
Throughout his career, Jeff has collaborated with talented individuals such as Jane Lu and Paul Y Wu. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Jeff Chang's contributions to the field of printed circuit board technology exemplify the importance of innovation in electronics. His patented method for thermally enhanced BGA packages showcases his commitment to advancing technology and improving product performance. His work at Unicap Electronics Industrial Corporation continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile