The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Apr. 13, 2000
Applicant:
Inventors:
Edward Huang, Tao-Yuan, TW;
Jonny Ma, Tax-Yuan, TW;
Scott Chen, Tao-Yuan, TW;
Paul Wu, Saratoga, CA (US);
Assignee:
Unicap Electronics Industrial Corporation, Hsien, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 ;
U.S. Cl.
CPC ...
H01K 3/10 ;
Abstract
A process for forming a burrless castellation for a plastic chip carrier comprising forming one or more through holes in a substrate, plating the through holes with a metal to a thickness ranging from about 2 microns to about 6 microns, routing slots along the line extending through the through holes to produce half cylinder-shaped side-contact surfaces, and plating the half cylinder-shaped side-contact surfaces to a thickness in the range of 15 to 25 microns.