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Asahikawa, Japan

Toshiba Hokuto Electronics Corporation

USPTO Granted Patents = 42

EPO Patents = 26

Forward Citations = 55

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37 inventors (with patents filed for the assignee):

Keiichi Maki (19 out of 61 patents)

Osamu Takagi (6 out of 292 patents)

Masatoshi Higashi (4 out of 4 patents)

4. Naoki Takojima (3 out of 4 patents)

5. Tsuyoshi Abe (3 out of 3 patents)

6. Yojiro Yarimizu (2 out of 2 patents)

7. Tomotsugu Jingi (2 out of 2 patents)

8. Megumi Yamauchi (2 out of 2 patents)

9. Seiichi Noro (2 out of 2 patents)

10. Masakatsu Doi (2 out of 2 patents)

11. Tsuyoshi Yamamoto (2 out of 2 patents)

12. Yoshihide Abe (2 out of 2 patents)

13. Tomonori Suzuki (2 out of 2 patents)

14. Yuuki Komori (2 out of 2 patents)

15. Naoya Kato (2 out of 2 patents)

42 patents: Sort by Forward Citations

1. 11189768 - Light emitting device, method of manufacturing light emitting device, and lighting tool for vehicle (2021-11-30),

2. 11094859 - Light emitting apparatus (2021-08-17),

3. 11029003 - Decoration device, method for using light emitting device, and vehicle (2021-06-08),

4. 10991866 - Light emitting module (2021-04-27),

5. 10985144 - Light emitting apparatus (2021-04-20),

6. 10910539 - Light emitting device and manufacturing method thereof (2021-02-02),

7. 10884367 - Heater and fixing device (2021-01-05),

8. 10879442 - Flexible and light-transmissible light-emitting device and method for manufacturing light-emitting device (2020-12-29),

9. 10879438 - Light emitting module and manufacturing method of light emitting module (2020-12-29),

10. 10864749 - Thermal print head and thermal printer (2020-12-15),

11. 10859954 - Heater and heating apparatus (2020-12-08),

12. 10854582 - Light-emitting module (2020-12-01),

13. 10777720 - Light emitting module and light emitting module manufacturing method (2020-09-15),

14. 10734365 - Light-emitting device (2020-08-04),

15. 10707192 - Light emitting panel comprising a plurality of light emitting modules (2020-07-07),

Toshiba Hokuto Electronics Corporation is a subsidiary of Toshiba Corporation, a globally renowned electronics and electrical equipment manufacturer. As a leading provider of semiconductor assembly and testing services, Hokuto Electronics specializes in advanced packaging, IC assembly, and test solutions. With a strong commitment to quality and innovation, the company serves diverse industries such as automotive, telecommunications, industrial, and more. For further information on Toshiba Hokuto Electronics Corporation, please visit their official website.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 2 2025

42 Patents

#1 in Asahikawa

#1,866 in Japan

#15,832 in the World

Asahikawa, Japan

Toshiba Hokuto Electronics Corporation

Forward Citations = 55

37 inventors:

Keiichi Maki (19 out of 61 patents)

Osamu Takagi (6 out of 292 patents)

Masatoshi Higashi (4 out of 4 patents)

4. Naoki Takojima (3 out of 4 patents)

5. Tsuyoshi Abe (3 out of 3 patents)

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