The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2020

Filed:

Sep. 20, 2019
Applicant:

Toshiba Hokuto Electronics Corporation, Asahikawa-Shi, JP;

Inventor:

Keiichi Maki, Asahikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H05K 1/02 (2006.01); H01L 33/42 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 23/3121 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 33/42 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H05K 1/028 (2013.01); H05K 1/185 (2013.01); H05K 3/323 (2013.01); H05K 3/361 (2013.01); H01L 2224/16225 (2013.01); H01L 2933/0066 (2013.01); H05K 1/0281 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10325 (2013.01);
Abstract

A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.


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