The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 17, 2021

Filed:

Aug. 21, 2019
Applicant:

Toshiba Hokuto Electronics Corporation, Asahikawa, JP;

Inventors:

Naoki Takojima, Asahikawa, JP;

Yojiro Yarimizu, Asahikawa, JP;

Tsuyoshi Abe, Asahikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); B32B 27/36 (2006.01); H01L 33/52 (2010.01); H01L 33/44 (2010.01); B32B 38/00 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); B32B 27/36 (2013.01); H01L 33/44 (2013.01); H01L 33/52 (2013.01); H01L 51/0097 (2013.01); H01L 51/5203 (2013.01); H01L 51/5246 (2013.01); H01L 51/5256 (2013.01); B32B 2038/0076 (2013.01); F21Y 2115/10 (2016.08); H01L 2251/30 (2013.01);
Abstract

Disclosed is a light emitting apparatus including: a first substrate having light transmissive property and flexibility with a conductive layer; a second substrate having light transmissive property and flexibility and arranged to face the first substrate; a plurality of light emitting elements including an electrode connected to the conductive layer and arranged between the first and second substrates; and a resin layer having light transmissive property and flexibility and arranged between the first and second substrates to hold the plurality of light emitting elements. A temperature for a maximum mechanical loss tangent tan δ in dynamic viscoelasticity of the resin layer is 117° C. or higher.


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