The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Dec. 07, 2018
Toshiba Hokuto Electronics Corporation, Asahikawa, JP;
Megumi Yamauchi, Asahikawa, JP;
Seiichi Noro, Asahikawa, JP;
Masakatsu Doi, Asahikawa, JP;
Tsuyoshi Yamamoto, Asahikawa, JP;
Yoshihide Abe, Asahikawa, JP;
Tomonori Suzuki, Asahikawa, JP;
Yuuki Komori, Asahikawa, JP;
Toshiba Hokuto Electronics Corporation, Asahikawa, JP;
Abstract
According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.