The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Jun. 19, 2018
Applicant:
Toshiba Hokuto Electronics Corporation, Asahikawa, JP;
Inventor:
Keiichi Maki, Suita, JP;
Assignee:
Toshiba Hokuto Electronics Corporation, Asahikawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H05K 1/11 (2006.01); H01L 33/56 (2010.01); H05B 33/06 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/56 (2013.01); H05B 33/06 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H01L 33/62 (2013.01); H01L 2933/0033 (2013.01); H05K 1/147 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10128 (2013.01);
Abstract
Disclosed is a light-emitting module including: a first insulation film having light transmissive property; a conductor layer provided on the first insulation film; a second insulation film disposed to face the first insulation film; a plurality of light-emitting elements interposed between the first insulation film and the second insulation film and have one surface on which a pair of electrodes connected to the conductor layer are provided; and a board that is connected to the first insulation film and has a circuit connected to the conductor layer.