logo

For the Inventor, By the Inventor

New Taipei, Taiwan

Taiwan Microloops Corp.


USPTO Granted Patents = 27

% Expired Patents = 3.7


Trademarks = 2

Forward Citations = 79

Loading Chart...
Loading Chart...

10 inventors (with patents filed for the assignee):

goldMedal Chun-Hung Lin (24 out of 50 patents)

silverMedal Chun-Teng Chiu (3 out of 3 patents)

bronzeMedal Yen-Chia Huang (2 out of 3 patents)

4.  Yi-Chung Chen (1 out of 3 patents)

5.  Chih-Wei Wang (1 out of 3 patents)

6.  Chien-Cheng Hsu (1 out of 1 patent)

7.  Yi-Shen Chien (1 out of 1 patent)

8.  Cherng-Yuh Su (1 out of 2 patents)

9.  Kuo-Ying Lee (1 out of 1 patent)

10.  Chien-Hung Liin (1 out of 1 patent)


Core Competencies:
Heat Dissipation
Vapor Chamber
Heat Pipe
Cooling Fan
Noise Cancellation
Thermal Conduction
Liquid Immersion Cooling
Heat Spreader
Distributive Cooling
Capillary Structure
Phase Change Transfer
Auxiliary Fan

27 patents:

1. 12760971 - Three-dimensional vapor chamber bonding structure (2026-10-13),
2. 12669294 - Heat dissipation structure combining vapor chamber with heat pipe and manufacturing method thereof (2026-06-30),
3. 12601550 - Grooved vapor chamber capillary reflow structure (2026-04-14),
4. 12535278 - Heat dissipation device of heat pipe combined with vapor chamber (2026-01-27),
5. 12490409 - Vapor chamber and manufacturing method thereof (2025-12-02),
6. 12436723 - Display card with noise reduction mechanism (2025-10-07),
7. 12374316 - Separate active noise cancellation device (2025-07-29),
8. 12276461 - Vapor chamber and single-piece support structure thereof (2025-04-14),
9. 12173969 - Separate capillary vapor chamber structure for dual heat sources (2024-12-24),
10. 12114464 - Liquid immersion cooler (2024-10-08),
11. 12010814 - Liquid immersion cooling sheet with improved surface structure (2024-06-11),
12. D1026838 - Heat dissipation module (2024-05-14),
13. 11892240 - Combination structure of vapor chamber and heat pipe (2024-02-06),
14. 11304331 - Heat dissipating module having auxiliary fan (2022-04-12),
15. 11125507 - Heat dissipating apparatus using phase change heat transfer (2021-09-21),
Company Overview
Taiwan Microloops Corp. is a prominent player in the field of advanced semiconductor technology, specializing in the development and manufacturing of high-performance microelectronic components. The company focuses on innovative solutions for various applications, including telecommunications, consumer electronics, and automotive systems. With a commitment to research and development, Taiwan Microloops Corp. aims to enhance the efficiency and functionality of electronic devices, contributing to the growth of the technology sector in Taiwan and beyond.
Profile summary synthesized from public USPTO records and patent filings.

logo

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

27 Patents

#101 in New Taipei

#644 in Taiwan

#24,012 in the World

New Taipei, TW
New Taipei, Taiwan

Taiwan Microloops Corp.

Forward Citations = 79

10 inventors:

goldMedal Chun-Hung Lin (24 out of 50 patents)

silverMedal Chun-Teng Chiu (3 out of 3 patents)

bronzeMedal Yen-Chia Huang (2 out of 3 patents)

4.  Yi-Chung Chen (1 out of 3 patents)

5.  Chih-Wei Wang (1 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Taiwan Microloops Corp.. Retrieved from https://idiyas.com/company/taiwan-microloops

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…