The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Apr. 15, 2024
Taiwan Microloops Corp., New Taipei City, TW;
Chun-Hung Lin, New Taipei City, TW;
TAIWAN MICROLOOPS CORP., New Taipei City, TW;
Abstract
A heat dissipation structure includes a vapor chamber (), a heat pipe () and a working fluid. The vapor chamber () includes an upper shell (), a lower shell () correspondingly sealed with the upper shell () and a first wick structure disposed on an inner surface of the upper shell (). A chamber (S) is defined between the upper shell () and the lower shell (). A penetration hole () communicating to the chamber (S) is defined on the upper shell (). A second wick structure () includes a revealing section () exposed from a hollow slot (). The working fluid is filled in the chamber (S). An inner diameter of the through hole () is smaller than that of the penetration hole (). The first wick structure () is embedded in the hollow slot () and attached to the revealing section ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile