The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
May. 15, 2024
Taiwan Microloops Corp., New Taipei, TW;
Chun-Hung Lin, New Taipei, TW;
TAIWAN MICROLOOPS CORP., New Taipei, TW;
Abstract
A heat dissipation device includes a vapor chamber () and at least one heat pipe (). The vapor chamber () includes a bottom plate () and a top plate () combined with each other to form a cavity (); the cavity () contains a top plate capillary layer () covering the top plate () which has at least one through hole (). The heat pipe () includes a pipe body () with a closed end () and an open end () fixed in the through hole (), and a pipe capillary layer () with a connecting portion (). The top plate () includes at least one protrusion () corresponding to the through hole () and having a receiving portion () recessed inside the top plate (), and a capillary structure () in the receiving portion () and contacting with the connecting portion () and top plate capillary layer ().
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile