Taipei, Taiwan

Chien-Cheng Hsu

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Microloops Corp.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chien-Cheng Hsu. Retrieved from https://idiyas.com/inventor/chien-cheng-hsu-svm0zi7j

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Chien-Cheng Hsu in Vapor Chamber Technology

Introduction

Chien-Cheng Hsu is a notable inventor based in New Taipei, Taiwan. He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on vapor chamber technology, which is essential for efficient heat dissipation in various applications.

Latest Patents

Chien-Cheng Hsu holds a patent for a vapor chamber and its manufacturing method. The patent describes a vapor chamber that includes a housing, a capillary structure, and at least two liquid-filling and gas-discharging pipes. The design allows for the working fluid to be evenly and widely distributed within the chamber, enhancing thermal performance.

Career Highlights

Hsu is associated with Taiwan Microloops Corporation, where he applies his expertise in thermal management solutions. His innovative approach has positioned him as a key player in the development of advanced cooling technologies.

Collaborations

Chien-Cheng Hsu collaborates with Chun-Hung Lin, contributing to the advancement of vapor chamber technology. Their combined efforts aim to improve the efficiency and effectiveness of thermal management systems.

Conclusion

Chien-Cheng Hsu's contributions to vapor chamber technology reflect his commitment to innovation in thermal management. His patent and work at Taiwan Microloops Corporation highlight the importance of effective heat dissipation in modern technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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