The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Apr. 20, 2022
Applicant:
Taiwan Microloops Corp., New Taipei, TW;
Inventor:
Chun-Teng Chiu, New Taipei, TW;
Assignee:
TAIWAN MICROLOOPS CORP., New Taipei, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02H 3/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20236 (2013.01); H05K 7/20263 (2013.01);
Abstract
A liquid immersion cooler includes a metal case, a soldering layer, a heat conduction layer, and a porous structure. The metal case has a heated surface and a cooling surface disposed on back of the heated surface. The soldering layer is laid on the cooling surface. The heat conduction layer is laid on the soldering layer. The porous structure is laid on the heat conduction layer. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.