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Sekisui Polymatech Co., Ltd.

USPTO Granted Patents = 41

% Expired Patents = 7.3

EPO Patents = 18

Trademarks = 4

Forward Citations = 13

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39 inventors (with patents filed for the assignee):

Hiroki Kudoh (9 out of 12 patents)

Shinichi Tomooka (4 out of 4 patents)

Yoshifumi Honmatsu (4 out of 5 patents)

4. Tsubasa Kamiya (4 out of 4 patents)

5. Hideaki Konno (4 out of 4 patents)

6. Yasuyoshi Watanabe (4 out of 4 patents)

7. Yasuyoshi Watanabe (3 out of 5 patents)

8. Shigeru Koyano (3 out of 3 patents)

9. Takaya Kimoto (3 out of 3 patents)

10. Yuta Ohsawa (3 out of 4 patents)

11. Yasushi Sakai (3 out of 3 patents)

12. Hiromi Suda (2 out of 2 patents)

13. Yasunari Kusaka (2 out of 22 patents)

14. Gaku Kitada (2 out of 3 patents)

15. Tomonari Yamada (2 out of 2 patents)

Core Competencies:

Thermally Conductive Sheet

Heat Conductive Sheet

Silicone Composition

Electrical Connection Member

Touch Sensor

Thermally Conductive Composition

Stretchable Wire Member

Heat-Dissipating Sheet

Sensor

Photocurable Composition

Input Operation Device

Magnetic Deformable Member

41 patents: Sort by Forward Citations

1. 12466984 - Thermally conductive sheet and method for manufacturing same (2025-11-11),

2. 12370729 - Heat conductive sheet and method for producing same (2025-07-29),

3. 12122916 - Silicone composition and curable grease (2024-10-22),

4. 12051879 - Connection component and connection structure (2024-07-30),

5. 12024018 - Decorative panel (2024-07-02),

6. 12021322 - Electrical connection sheet and terminal-equipped glass plate structure (2024-06-25),

7. 11993679 - Thermally conductive sheet (2024-05-28),

8. 11987687 - Heat conductive sheet (2024-05-21),

9. 11987686 - Thermally conductive sheet (2024-05-21),

10. 11987124 - Capacitive input device (2024-05-21),

11. 11881643 - Electrical connection member, and glass plate structure with terminal (2024-01-23),

12. 11855368 - Electrical connecting member, and glass plate structure with terminal (2023-12-26),

13. 11852510 - Sensor and method for manufacturing the same (2023-12-26),

14. 11781052 - Thermally conductive composition and thermally conductive molded body (2023-10-10),

15. 11702579 - Thermally conductive composition, thermally conductive sheet, and method for producing thermally conductive sheet (2023-07-18),

Company Overview

Sekisui Polymatech Co., Ltd., based in Saitama, Japan, specializes in advanced materials and solutions for thermal management and electrical connectivity. The company focuses on the development and manufacturing of thermally conductive sheets, heat conductive sheets, and silicone compositions, catering to various industries including electronics and automotive. Their innovative products also encompass capacitive input devices, touch sensors, and stretchable wiring members, demonstrating a commitment to enhancing performance and reliability in modern applications.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

41 Patents

#39 in Saitama 343-0827

#1,944 in Japan

#16,725 in the World

Sekisui Polymatech Co., Ltd.

Forward Citations = 13

39 inventors:

Hiroki Kudoh (9 out of 12 patents)

Shinichi Tomooka (4 out of 4 patents)

Yoshifumi Honmatsu (4 out of 5 patents)

4. Tsubasa Kamiya (4 out of 4 patents)

5. Hideaki Konno (4 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sekisui Polymatech Co., Ltd.. Retrieved from https://idiyas.com/company/sekisui-polymatech-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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