The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Dec. 02, 2020
Applicant:
Sekisui Polymatech Co., Ltd., Saitama, JP;
Inventor:
Hiroki Kudoh, Kawaguchi, JP;
Assignee:
SEKISUI POLYMATECH CO., LTD., Saitama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 13/00 (2006.01); B29C 35/02 (2006.01); B29C 45/00 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08J 5/18 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); F28F 21/02 (2006.01); H01L 23/40 (2006.01); H01L 23/467 (2006.01); B29K 83/00 (2006.01); B29K 305/02 (2006.01); B29L 7/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0001 (2013.01); B29C 35/02 (2013.01); B29C 45/0013 (2013.01); B29C 45/0055 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08J 5/18 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); F28F 21/02 (2013.01); B29C 2045/0075 (2013.01); B29C 2793/009 (2013.01); B29K 2083/00 (2013.01); B29K 2305/02 (2013.01); B29K 2995/0013 (2013.01); B29L 2007/002 (2013.01); C08J 2383/07 (2013.01); C08J 2483/05 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); F28F 2013/006 (2013.01);
Abstract
An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7:Load property=()/ (1)