logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12466984 B1

PDFFull Text
Date of Patent:
Nov. 11, 2025

Filed:

May. 27, 2021

Thermally conductive sheet and method for manufacturing same

Applicant:

Sekisui Polymatech Co., Ltd., Saitama, JP;

Inventors:

Hiroki Kudoh, Kawaguchi, JP;

Miho Ishihara, Ibaraki, JP;

Assignee:

SEKISUI POLYMATECH CO., LTD., Saitama, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

Sheeba Ahmed

Int. Cl.
CPC ...
C09K 5/14 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 37/15 (2006.01); B32B 38/00 (2006.01); C08J 5/12 (2006.01); C08K 13/04 (2006.01); F28F 21/06 (2006.01); H05K 7/20 (2006.01); C08K 3/38 (2006.01); C08K 7/06 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 37/15 (2013.01); B32B 38/0004 (2013.01); C08J 5/12 (2013.01); C08K 13/04 (2013.01); F28F 21/065 (2013.01); H05K 7/20445 (2013.01); B32B 2250/24 (2013.01); B32B 2305/77 (2013.01); B32B 2307/302 (2013.01); B32B 2307/706 (2013.01); B32B 2310/0831 (2013.01); B32B 2383/00 (2013.01); C08J 2383/05 (2013.01); C08J 2383/07 (2013.01); C08K 2003/385 (2013.01); C08K 7/06 (2013.01); C08K 7/18 (2013.01); C08K 2201/001 (2013.01); C08K 2201/014 (2013.01);
Abstract

The present invention is a thermally conductive sheet comprising a plurality of unit layers, each comprising a silicone resin and a thermally conductive filler, the plurality of unit layers being laminated such that the plurality of unit layers are adhered to each other, wherein a volume content of the silicone resin is 32% by volume or less, and a compressive load at a sheet area of 25.4 mm×25.4 mm when the thermally conductive sheet is 30% compressed from a direction perpendicular to an adhesion plane on which the plurality of unit layers are adhered to each other is 7.0 kgf or less. According to the present invention, it is possible to improve the thermal conductivity and enhance the softness of a thermally conductive sheet using a silicone resin as a matrix component and composed of a large number of unit layers laminated as compared with the conventional one.

Find Patent Forward Citations

Loading…