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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12122916 B1

PDFFull Text
Date of Patent:
Oct. 22, 2024

Filed:

Mar. 25, 2020

Silicone composition and curable grease

Applicant:

Sekisui Polymatech Co., Ltd., Saitama, JP;

Inventors:

Takaaki Mizuno, Saitama, JP;

Shigeru Koyano, Saitama, JP;

Assignee:

SEKISUI POLYMATECH CO., LTD., Saitama, JP;

Attorneys:

Future IP LLC

Tomoko Nakajima

Primary Examiner:

C Melissa Koslow

Int. Cl.
CPC ...
C08L 83/04 (2006.01); C09K 5/14 (2006.01); C10M 107/50 (2006.01); C10M 111/04 (2006.01); C10M 125/02 (2006.01); C10M 125/04 (2006.01); C10M 125/10 (2006.01); C10M 145/40 (2006.01); C10M 169/04 (2006.01); C10M 171/00 (2006.01); C10M 177/00 (2006.01); C10N 10/16 (2006.01); C10N 40/14 (2006.01); C10N 50/10 (2006.01); H01F 1/113 (2006.01); H01F 1/12 (2006.01); H01F 1/33 (2006.01); H01F 1/37 (2006.01); H01F 1/44 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C09K 5/14 (2013.01); C10M 107/50 (2013.01); C10M 111/04 (2013.01); C10M 125/02 (2013.01); C10M 125/04 (2013.01); C10M 125/10 (2013.01); C10M 145/40 (2013.01); C10M 169/04 (2013.01); C10M 171/00 (2013.01); C10M 177/00 (2013.01); H01F 1/113 (2013.01); H01F 1/12 (2013.01); H01F 1/33 (2013.01); H01F 1/37 (2013.01); H01F 1/44 (2013.01); H01F 1/445 (2013.01); H01F 1/447 (2013.01); C08L 2207/324 (2013.01); C10M 2201/041 (2013.01); C10M 2201/05 (2013.01); C10M 2201/06 (2013.01); C10M 2201/062 (2013.01); C10M 2201/105 (2013.01); C10M 2209/12 (2013.01); C10M 2229/025 (2013.01); C10N 2010/16 (2013.01); C10N 2040/14 (2013.01); C10N 2050/10 (2013.01);
Abstract

A silicone composition having an electromagnetic wave absorbing property and thermal conductivity includes liquid silicone; a high-specific-gravity soft magnetic filler having a specific gravity of 4.5 or greater; an intermediate-specific-gravity thermally conductive filler having a specific gravity of 4.0 or less; and a non-liquid anti-thickening and anti-settling agent. Furthermore, a curable grease is a two-component curable grease including a combination of a base compound and a curing agent that are used by being mixed together when used, the curable grease being to be cured by mixing of the base compound with the curing agent. The base compound is a silicone composition of the present invention, in which the liquid silicone is an organopolysiloxane having a vinyl group at an end thereof. The curing agent is a silicone composition of the present invention, in which the liquid silicone is an organohydrogenpolysiloxane.

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