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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11781052 B1

PDFFull Text
Date of Patent:
Oct. 10, 2023

Filed:

Jan. 16, 2019

Thermally conductive composition and thermally conductive molded body

Applicant:

Sekisui Polymatech Co., Ltd., Saitama, JP;

Inventor:

Hiroshi Umetani, Saitama, JP;

Assignee:

SEKISUI POLYMATECH CO., LTD., Saitama, JP;

Attorneys:

Cermak Nakajima & McGowan LLP

Tomoko Nakajima

Primary Examiner:

James C Goloboy

Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08G 77/04 (2006.01); C08J 5/18 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C09D 183/04 (2006.01); C08L 83/04 (2006.01); C08G 77/00 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08G 77/04 (2013.01); C08J 5/18 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08L 83/04 (2013.01); C09D 183/04 (2013.01); C08G 77/80 (2013.01); C08J 2383/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); H01L 23/36 (2013.01);
Abstract

The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are exhibited, and provides a molded body of the thermally conductive composition. A thermally conductive composition, in which a thermally conductive filler is contained in a polymer matrix, includes a methyl phenyl silicone, characterized in that the thermally conductive filler has an average particle size of 10 to 100 μm, the content of the thermally conductive filler in the thermally conductive composition is 70% to 90% by volume, and 30% to 80% by volume of the thermally conductive filler has a particle size of 40 μm or more. A thermally conductive molded body is formed of a cured body of the thermally conductive composition.

Find Patent Forward Citations

Umetani, Hiroshi. (2023). Thermally conductive composition and thermally conductive molded body (U.S. Patent No. 11781052). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11781052

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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