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Yokohama, Japan

Niterra Materials Co., Ltd.

USPTO Granted Patents = 18

EPO Patents = 7

Forward Citations = 0

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59 inventors (with patents filed for the assignee):

Daichi Usui (4 out of 10 patents)

Takahiro Kawamoto (3 out of 42 patents)

Seiichi Suenaga (3 out of 55 patents)

4. Hideaki Hirabayashi (3 out of 27 patents)

5. Hideaki Baba (3 out of 5 patents)

6. Kenji Tomokiyo (3 out of 4 patents)

7. Hitoshi Aoyama (3 out of 3 patents)

8. Tomohiro Yamashita (2 out of 92 patents)

9. Tomoko Eguchi (2 out of 33 patents)

10. Akiko Saito (2 out of 100 patents)

11. Masaya Hagiwara (2 out of 46 patents)

12. Sachiko Fujisawa (2 out of 8 patents)

13. Masanori Mizobe (2 out of 3 patents)

14. Hideki Sato (2 out of 5 patents)

15. Hiromasa Kato (2 out of 2 patents)

18 patents: Sort by Forward Citations

1. 12749591 - Tungsten wire, and tungsten wire processing method and electrolytic wire using the same (2026-09-29),

2. 12747380 - Granulated particle for cold storage material particle, cold storage material particle, cold storage device, refrigerator, cryopump superconducting magnet, nuclear magnetic resonance imaging apparatus, nuclear magnetic resonance apparatus, magnetic field application type single crystal pulling apparatus, and helium re-condensing device (2026-09-29),

3. 12742895 - Ceramic scintillator, photon-counting type X-ray detector, and method for manufacturing ceramic scintillator (2026-09-22),

4. 12721197 - Insulating circuit board and semiconductor device using same (2026-08-25),

5. 12693246 - Crystal phase information extraction apparatus, crystal phase information extraction method and storage medium (2026-07-28),

6. 12679771 - Ceramic scribe substrate, ceramic substrate, method for manufacturing ceramic scribe substrate, method for manufacturing ceramic substrate, method for manufacturing ceramic circuit board, and method for manufacturing semiconductor element (2026-07-14),

7. 12667901 - Heat treatment furnace apparatus (2026-06-30),

8. 12667900 - Method for manufacturing ceramic circuit board (2026-06-30),

9. 12666965 - Bonded body, ceramic circuit substrate, and semiconductor device (2026-06-23),

10. 12642091 - Bonded body, ceramic-copper circuit board, and semiconductor device (2026-05-26),

11. 12624728 - Ceramic ball material, method for manufacturing ceramic ball using same, and ceramic ball (2026-05-12),

12. 12624727 - Ceramic ball material comprising a band-portion over surface of a spherical portion, and method for manufacturing ceramic ball (2026-05-12),

13. 12606890 - Tungsten wire, tungsten wire processing method using the same, and electrolyzed wire (2026-04-21),

14. 12569909 - Metal powder for 3D printer, shaped article, and method for manufacturing shaped article (2026-03-10),

15. 12563665 - Insulating circuit board and semiconductor device in which same is used (2026-02-24),

Niterra Materials Co., Ltd., based in Yokohama, Japan, specializes in the development and manufacturing of advanced materials and components for various industries. The company focuses on innovative solutions in the fields of electronics, automotive, and energy, leveraging cutting-edge technology to enhance performance and sustainability. Niterra is committed to research and development, aiming to create high-quality products that meet the evolving needs of its global clientele while promoting environmental responsibility.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

18 Patents

#56 in Yokohama

#3,121 in Japan

#34,187 in the World

Yokohama, Japan

Niterra Materials Co., Ltd.

Forward Citations = 0

59 inventors:

Daichi Usui (4 out of 10 patents)

Takahiro Kawamoto (3 out of 42 patents)

Seiichi Suenaga (3 out of 55 patents)

4. Hideaki Hirabayashi (3 out of 27 patents)

5. Hideaki Baba (3 out of 5 patents)

Please report any incorrect information to [email protected]

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