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Yokohama, Japan

Niterra Materials Co., Ltd.

USPTO Granted Patents = 15

EPO Patents = 6

Forward Citations = 0

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45 inventors (with patents filed for the assignee):

Seiichi Suenaga (3 out of 55 patents)

Hideaki Hirabayashi (3 out of 27 patents)

Tomohiro Yamashita (2 out of 91 patents)

4. Tomoko Eguchi (2 out of 32 patents)

5. Akiko Saito (2 out of 100 patents)

6. Masaya Hagiwara (2 out of 46 patents)

7. Takahiro Kawamoto (2 out of 41 patents)

8. Hideaki Baba (2 out of 4 patents)

9. Kenji Tomokiyo (2 out of 3 patents)

10. Sachiko Fujisawa (2 out of 8 patents)

11. Daichi Usui (2 out of 3 patents)

12. Masanori Mizobe (2 out of 3 patents)

13. Hideki Sato (2 out of 5 patents)

14. Hiromasa Kato (2 out of 2 patents)

15. Hitoshi Aoyama (2 out of 2 patents)

15 patents: Sort by Forward Citations

1. 12721197 - Insulating circuit board and semiconductor device using same (2026-08-25),

2. 12693246 - Crystal phase information extraction apparatus, crystal phase information extraction method and storage medium (2026-07-28),

3. 12679771 - Ceramic scribe substrate, ceramic substrate, method for manufacturing ceramic scribe substrate, method for manufacturing ceramic substrate, method for manufacturing ceramic circuit board, and method for manufacturing semiconductor element (2026-07-14),

4. 12667901 - Heat treatment furnace apparatus (2026-06-30),

5. 12667900 - Method for manufacturing ceramic circuit board (2026-06-30),

6. 12666965 - Bonded body, ceramic circuit substrate, and semiconductor device (2026-06-23),

7. 12642091 - Bonded body, ceramic-copper circuit board, and semiconductor device (2026-05-26),

8. 12624728 - Ceramic ball material, method for manufacturing ceramic ball using same, and ceramic ball (2026-05-12),

9. 12624727 - Ceramic ball material comprising a band-portion over surface of a spherical portion, and method for manufacturing ceramic ball (2026-05-12),

10. 12606890 - Tungsten wire, tungsten wire processing method using the same, and electrolyzed wire (2026-04-21),

11. 12569909 - Metal powder for 3D printer, shaped article, and method for manufacturing shaped article (2026-03-10),

12. 12563665 - Insulating circuit board and semiconductor device in which same is used (2026-02-24),

13. 12559823 - Tungsten wire, and tungsten wire processing method and electrolytic wire using the same (2026-02-24),

14. 12559660 - Cold storage material, refrigerator, device incorporating superconducting coil, and method of manufacturing cold storage material (2026-02-24),

15. 12534658 - Cold storage material, refrigerator, device incorporating superconducting coil, and method of manufacturing cold storage material (2026-01-27),

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

15 Patents

#65 in Yokohama

#3,439 in Japan

#39,801 in the World

Yokohama, Japan

Niterra Materials Co., Ltd.

Forward Citations = 0

45 inventors:

Seiichi Suenaga (3 out of 55 patents)

Hideaki Hirabayashi (3 out of 27 patents)

Tomohiro Yamashita (2 out of 91 patents)

4. Tomoko Eguchi (2 out of 32 patents)

5. Akiko Saito (2 out of 100 patents)

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