This inventor holds 3 USPTO granted patents and 4 published patent applications. Top assignee: Niterra Materials Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hitoshi Aoyama: Innovator in Tungsten Wire Technology
Introduction
Hitoshi Aoyama is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of tungsten wire technology, holding a total of 3 patents. His work focuses on innovative methods and materials that enhance the performance and processing of tungsten wires.
Latest Patents
Aoyama's latest patents include advancements in tungsten wire and tungsten wire processing methods. One of his notable inventions is a tungsten wire made of a W alloy containing rhenium. This tungsten wire features a mixture on at least a part of its surface, which includes W, C, and O as constituent elements. The average value of the ratio of the radial cross-sectional thickness of the mixture to the diameter of the tungsten wire is maintained between 0.3% to 0.8%. Another patent involves a tungsten wire that includes a tungsten alloy containing rhenium, characterized by a protrusion peak density (Spd) of 7000 or more and 11000 or less as a surface roughness parameter.
Career Highlights
Aoyama is currently associated with Niterra Materials Co., Ltd., where he continues to innovate in the field of materials science. His expertise in tungsten wire technology has positioned him as a key figure in the industry.
Collaborations
Throughout his career, Aoyama has collaborated with notable colleagues, including Hideaki Baba and Kenji Tomokiyo. These partnerships have contributed to the advancement of tungsten wire technologies and have fostered a collaborative environment for innovation.
Conclusion
Hitoshi Aoyama's contributions to tungsten wire technology exemplify his dedication to innovation and excellence. His patents reflect a commitment to improving material properties and processing methods, making a significant impact in his field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile