The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2026

Filed:

Jul. 28, 2023
Applicant:

Niterra Materials Co., Ltd., Yokohama, JP;

Inventors:

Hitoshi Aoyama, Yokohama, JP;

Hideaki Baba, Yokohama, JP;

Kenji Tomokiyo, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 27/04 (2006.01); B21B 1/18 (2006.01); B22F 3/14 (2006.01); B22F 3/24 (2006.01); B22F 5/12 (2006.01); C22C 1/04 (2023.01); C22F 1/02 (2006.01); C22F 1/18 (2006.01); C25F 3/26 (2006.01);
U.S. Cl.
CPC ...
C22C 27/04 (2013.01); B21B 1/18 (2013.01); B22F 3/14 (2013.01); B22F 3/24 (2013.01); B22F 5/12 (2013.01); C22C 1/045 (2013.01); C22F 1/02 (2013.01); C22F 1/18 (2013.01); C25F 3/26 (2013.01); B22F 2003/247 (2013.01); B22F 2003/248 (2013.01); B22F 2201/013 (2013.01); B22F 2301/20 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01);
Abstract

A tungsten wire according to an embodiment is a tungsten wire made of a W alloy containing rhenium, and includes a mixture on at least a part of a surface thereof, the mixture contains W, C, and O as constituent elements, and taking a radial cross-sectional thickness of the mixture as A mm and a diameter of the tungsten wire as B mm, an average value of a ratio A/B of A to B is 0.3% to 0.8%.


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