The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2026

Filed:

Jan. 25, 2024
Applicant:

Niterra Materials Co., Ltd., Yokohama, JP;

Inventors:

Hitoshi Aoyama, Yokohama, JP;

Hideaki Baba, Yokohama, JP;

Kenji Tomokiyo, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/14 (2006.01); C22C 38/04 (2006.01); H01B 1/02 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/02 (2013.01); H01B 13/0006 (2013.01);
Abstract

According to one embodiment, a tungsten wire includes a tungsten alloy containing rhenium. According to an EBSD analysis on a unit area, crystalline orientations having an orientation difference of 15 degrees or less from <101>, which is parallel to a wire drawing direction, account for an area ratio of 70% or more and 90% or less to a measurement field on an IPF map. The unit area is a 40 μm×40 μm area located within a range of 100 μm concentrically extending from a central axis in a cross-section along a wire radial direction, which is perpendicular to the wire drawing direction.


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