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Taichung, Taiwan

Lingsen Precision Industries, Ltd.

USPTO Granted Patents = 34

Forward Citations = 105

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26 inventors (with patents filed for the assignee):

Ming-Te Tu (23 out of 26 patents)

Yao-Ting Yeh (8 out of 9 patents)

Hsien-Ken Liao (4 out of 8 patents)

4. Yu-Chen Lin (4 out of 25 patents)

5. Ching-I Lin (3 out of 3 patents)

6. Jyong-Yue Tian (3 out of 4 patents)

7. Chao-Wei Yu (3 out of 4 patents)

8. Chien-Ko Liao (2 out of 16 patents)

9. Chiung-Yueh Tien (2 out of 2 patents)

10. Tzu-Chih Lin (2 out of 3 patents)

11. Mu Tsan Liao (2 out of 2 patents)

12. Jen-Chuan Yeh (2 out of 2 patents)

13. Kuo-Ting Lee (2 out of 2 patents)

14. Hsin-Chen Yang (2 out of 2 patents)

15. Wei-Jen Chen (1 out of 68 patents)

34 patents: Sort by Forward Citations

1. 11410856 - Chip packaging method (2022-08-09),

2. 11041774 - Pressure sensor package (2021-06-22),

3. 10696543 - Waterproof MEMS chip package structure (2020-06-30),

4. 10396234 - Package structure of long-distance sensor and packaging method of the same (2019-08-27),

5. 10362377 - MEMS microphone package (2019-07-23),

6. 10312169 - Substrate and package module including the same (2019-06-04),

7. 10299046 - MEMS microphone package (2019-05-21),

8. 10103286 - Packaging method of long-distance sensor (2018-10-16),

9. 10090427 - Package structure of long-distance sensor and packaging method of the same (2018-10-02),

10. 10003874 - Microphone package structure (2018-06-19),

11. 9952089 - Optical sensing module and method of manufacturing the same (2018-04-24),

12. 9905548 - Optical module integrated package (2018-02-27),

13. 9705025 - Package structure of an optical module (2017-07-11),

14. 9647178 - Package structure of optical module having printed shielding layer and its method for packaging (2017-05-09),

15. 9618415 - Pressure sensor package (2017-04-11),

Lingsen Precision Industries, Ltd. is a prominent player in the semiconductor industry, specializing in the development and manufacturing of advanced packaging solutions. The company focuses on providing innovative technologies that enhance the performance and reliability of electronic components. With a strong emphasis on research and development, Lingsen is dedicated to advancing the capabilities of semiconductor devices, catering to a global market from its headquarters in Taichung, Taiwan.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

34 Patents

#55 in Taichung

#538 in Taiwan

#19,594 in the World

Taichung, Taiwan

Lingsen Precision Industries, Ltd.

Forward Citations = 105

26 inventors:

Ming-Te Tu (23 out of 26 patents)

Yao-Ting Yeh (8 out of 9 patents)

Hsien-Ken Liao (4 out of 8 patents)

4. Yu-Chen Lin (4 out of 25 patents)

5. Ching-I Lin (3 out of 3 patents)

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