The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Nov. 05, 2013
Applicant:

Lingsen Precision Industries, Ltd., Taichung, TW;

Inventors:

Ming-Te Tu, Taichung, TW;

Yao-Ting Yeh, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 25/16 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/48 (2013.01); H01L 25/167 (2013.01); H01L 33/58 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A package structure of an optical module includes: a substrate having a frame defined with a light-emitting region and a light-admitting region; a light-emitting chip disposed at the light-emitting region of the substrate; a light-admitting chip disposed at the light-admitting region of the substrate; two encapsulants formed in the frame and enclosing the light-emitting chip and the light-admitting chip, respectively; and a shielding layer formed on the frame and the encapsulants and having a light-emitting hole and a light-admitting hole, wherein the light-emitting hole and the light-admitting hole are positioned above the light-emitting chip and the light-admitting chip, respectively. The optical module package structure uses an opaque glue to reduce costs and total thickness of the package structure.


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