Hsien-Ken Liao

Title: Hsien-Ken Liao: Innovator in Sound Technology

Introduction

Hsien-Ken Liao is a distinguished inventor based in Taichung, Taiwan. With a total of 8 patents to his name, Liao has made significant contributions to the field of sound technology. His innovative designs focus on enhancing the acoustic experience through unique package structures and manufacturing methods.

Latest Patents

Among his most recent patents, Liao has developed groundbreaking inventions such as the sound producing package structure and manufacturing method. This patent describes a sound producing package that consists of a shell and a chip. The configuration includes a top structure, bottom structure, and sidewall structure. The chip, situated inside the shell, can generate acoustic waves thanks to its thin film structure and actuator. The design allows acoustic waves to emanate outward through an opening in the sidewall.

Another notable invention by Liao is a sound producing package structure featuring a first sub-package structure and a second sub-package structure. The first sub-package includes a substrate with an opening and a first chip with a membrane, forming a cavity between them. The second sub-package is connected to the first and contains a second chip with its own membrane, creating an additional cavity. This inventive structure facilitates a seamless connection between sound cavities, enhancing the acoustic performance of the package.

Career Highlights

Hsien-Ken Liao has contributed his expertise to renowned companies in the industry. He has worked at Lingsen Precision Industries, Ltd. and Xmems Labs, Inc. His experience in these firms has undoubtedly shaped his innovative journey and provided a platform for the development of his inventive solutions.

Collaborations

Throughout his career, Liao has collaborated with esteemed colleagues including Ming-Te Tu and Chiung C Lo. These collaborations have fostered a synergistic approach to technological advancement in acoustics, resulting in groundbreaking innovations.

Conclusion

In summary, Hsien-Ken Liao is a forward-thinking inventor whose work in sound technology continues to inspire advancements in the field. With a solid portfolio of patents, innovative package structures, and meaningful collaborations, Liao is making a remarkable impact on the future of acoustic solutions.