The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 16, 2016
Filed:
Nov. 03, 2014
Lingsen Precision Industries, Ltd., Taichung, TW;
Hsien-Ken Liao, Taichung, TW;
Ming-Te Tu, Taichung, TW;
LINGSEN PRECISION INDUSTRIES, LTD., Taichung, TW;
Abstract
A stacked MEMS microphone packaging method includes the steps of: providing a substrate having a conducting part and a through hole; affixing a retaining wall to the substrate and forming a conducting circuit in electrical connection with the conducting part; mounting a processor chip and a sensor chip on the substrate to have the sensor chip be disposed at a top side of the through hole; providing a carrier board having a first solder pad and a second solder pad and fixedly mounting the carrier board at the retaining wall and electrically coupled to the first solder pad and the second solder pad. Thus, the method can make a flip architecture MEMS microphone, reducing the steps of the packaging process and lowering the degree of difficulty of the manufacturing process and the manufacturing costs.