The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2023

Filed:

Jun. 16, 2021
Applicant:

Xmems Labs, Inc., Santa Clara, CA (US);

Inventors:

Chiung C. Lo, San Jose, CA (US);

Hsien-Ken Liao, Taichung, TW;

Martin George Lim, Hillsborough, CA (US);

Assignee:

xMEMS Labs, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H04R 3/00 (2006.01); H04R 31/00 (2006.01); H04R 7/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/025 (2013.01); H04R 1/023 (2013.01); H04R 3/00 (2013.01); H04R 7/04 (2013.01); H04R 31/006 (2013.01);
Abstract

A sound producing package structure includes a shell and a chip. The shell includes a top structure, a bottom structure and a sidewall structure. The chip is disposed inside the shell and configured to produce an acoustic wave, wherein the chip includes a thin film structure and an actuator configured to actuate the thin film structure, and the thin film structure is substantially parallel to the top structure and the bottom structure. A first opening is formed on the sidewall structure, and the acoustic wave propagates outwards through the first opening.


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