The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2019

Filed:

Oct. 27, 2016
Applicant:

Lingsen Precision Industries, Ltd., Taichung, TW;

Inventors:

Hsien-Ken Liao, Taichung, TW;

Ming-Te Tu, Taichung, TW;

Jyong-Yue Tian, Taichung, TW;

Yao-Ting Yeh, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 19/04 (2006.01); B81B 7/00 (2006.01); H04R 1/04 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 7/007 (2013.01); B81C 1/0023 (2013.01); H04R 1/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/095 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.


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